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+ IC Substrates ≥12 µm
+ HDI/Flex & RF ≥25 µm
+ QTA & Sampling ≥25µm
+ Solder Mask
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Laser Direct Imaging

Orbotech delivers a breakthrough range of LDI systems with its field-proven LSO (Large Scan Optics) Technology™ for the production of advanced HDI and high-yield packaging boards.  

  IC Substrates ≥12 µm  
  HDI/Flex & RF ≥25 µm  
  QTA & Sampling ≥25µm  
  Solder Mask  

Orbotech's field-proven systems achieve new levels of powerful LDI performance at high speed  and cost-effectively for mass production of advanced HDI  and Flex/Rigid boards. With LSO (Large Scan Optics) technology – yield improvements are achieved even on the most difficult jobs – including complex designs with fine features down to 25µm (1 mil).

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LDI Resist Article
LDI Mass Production Article

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