Yavne, Israel –  Orbotech Ltd. today announced the introduction of its new Paragon™-SM 20 Laser Direct Imaging (LDI) system for bare printed circuit board (PCB) manufacturing.

Paragon-SM 20 is a high accuracy, fast throughput LDI solution for imaging Solder Mask layers in QTA and Sampling as well as HDI and Rigid-Flex/ Flex applications. Based on Orbotech’s field-proven Large Scan Optics (LSO) Technology™, Paragon-SM 20 ensures high yields and lower cost per panel while satisfying tight registration accuracy requirements with dynamic imaging modes.

“We are very pleased to yet again extend our LDI product offering. This new model answers our customers’ requests for a dedicated solution, based on Paragon technology, for digital imaging on solder mask”, said Mr. Hanan Gino, President of the PCB Division at Orbotech Ltd. “The system has already been field-proven by PCB manufacturers to provide leading Paragon capabilities in registration, accuracy, image quality, depth-of-focus and resolution for superior results.”

With positioning accuracy of ±12µm (mm model) or ±0.5mil (inch model), Paragon-SM 20 images even the tightest annular rings. The system includes a range of dynamic imaging modes to meet production demands. Its depth-of-focus of ±300μm overcomes the most challenging surface topography changes and/or distorted PCB topography to ensure superior image quality on the solder mask layer.Paragon-SM 20 recognizes a wide range of different target types regardless of solder resist color to meet production requirements. The system has a user-friendly and intuitive graphic user interface for simple operation and seamless connectivity to CAM to ensure fast and easy set-up.

About Orbotech Ltd.

Orbotech is principally engaged in the design, development, manufacture, marketing and service of yield-enhancing and production solutions for specialized applications in the supply chain of the electronics industry. Orbotech’s products include automated optical inspection (AOI), production and process control systems for printed circuit boards (PCBs) and AOI, test and repair systems for flat panel displays (FPDs). The Company also markets computer-aided manufacturing and engineering (CAM) solutions for PCB production. In addition, through its subsidiary, Orbograph Ltd., the Company develops and markets character recognition solutions to banks and other financial institutions, and has developed a proprietary technology for web-based, location-independent data entry for check processing and forms processing; and, through its subsidiaries, Orbotech Medical Denmark A/S and Orbotech Medical Solutions Ltd., is engaged in the research and development, manufacture and sale of specialized products for application in medical nuclear imaging. Of Orbotech’s employees, more than one quarter are scientists and engineers, who integrate their multi-disciplinary knowledge, talents and skills to develop and provide sophisticated solutions and technologies designed to meet customers’ long-term needs. Orbotech maintains its headquarters and its primary research, development and manufacturing facilities in Israel, and more than 30 offices worldwide. Orbotech’s extensive network of marketing, sales and customer support teams throughout North America, Europe, the Pacific Rim, China and Japan deliver its knowledge and expertise directly to customers the world over. For more information visit www.orbotech.com.

Except for historical information, the matters discussed in this press release are forward-looking statements within the meaning of the U.S. Private Securities Litigation Reform Act of 1995. These statements relate to, among other things, future prospects, developments and business strategies and involve certain risks and uncertainties. The words “anticipate,” “believe,” “could,” “will,” “plan,” “expect” and “would” and similar terms and phrases, including references to assumptions, have been used in this press release to identify forward-looking statements. These forward-looking statements are made based on management’s expectations and beliefs concerning future events affecting Orbotech and are subject to uncertainties and factors relating to its operations and business environment, all of which are difficult to predict and many of which are beyond the Company’s control. Many factors could cause the actual results to differ materially from those projected, including cyclicality in the industries in which the Company operates, a sustained continuation or worsening of the worldwide economic slowdown, the timing and strength of product and service offerings by the Company and its competitors, changes in business or pricing strategies, changes in the prevailing political and regulatory framework in which the relevant parties operate or in economic or technological trends or conditions, including currency fluctuations, inflation and consumer confidence, on a global, regional or national basis and other risks detailed in the Company’s SEC reports, including the Company’s Annual Report on Form 20-F. The Company assumes no obligation to update the information in this press release to reflect new information, future events or otherwise, except as required by law.